SITRI, founded in 2013, is a research center, engineering resource and incubator for startups with a focus on the Internet of Things. SITRI is building a 200mm pilot line wafer fab for MEMS and other processes to help with that function.
The framework collaboration agreement includes microelectromechanical systems (MEMS) and sensors, 5G radio-frequency (RF) front ends, ultra-low power computing and communication, radio-frequency silicon-on-insulator (RFSOI) and fully depleted silicon-on-insulator (FDSOI) technologies.
CEA-Leti has pioneered silicon-on-insulator, MEMS and NEMS systems and the use of through silicon vias for 3D monolithic integration.
“Through this agreement and SITRI’s established platform for More-than-Moore commercialization, we can accelerate the adoption of these latest technologies and create a global innovation ecosystem for emerging IoT applications,” said Charles Yang, president of SITRI in a statement.
Marie-Noëlle Semeria, CEO of Leti, commented: “Through this partnership, SITRI, Minatec, CEA-Leti and the entire ecosystem will be able to promote and extend this ecosystem to SOI partners worldwide, and provide SOI solutions to the emerging Chinese IoT market.”