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H-bridge MOSFET modules target both soft- and hard-switching applications

H-bridge MOSFET modules target both soft- and hard-switching applications

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By Nick Flaherty



The fastPACK 0 MOS and fastPACK 1 MOS modules use a cost-effective H-bridge topology with MOSFETs and integrated capacitors in a rugged housing, which makes them suitable for both soft- and hard-switching applications.

The fastPACK 0 MOS module is rated for 650 V / 80 mΩ and fastPACK 1 MOS for 40 mΩ – 20 mΩ. Both come with integrated fast body diodes that enable ZVS for improved efficiency and provide limited voltage overshoot during hard commutation, thereby improving reliability and reducing EMI.

The 0 module is packaged in the low-inductive 35 x 37 mm flow 0 housing; the other in the 36 x 82 mm flow 1 housing. These two products feature reduced turn-on and turn-off delay times for easier controlling and less design effort.

For more information please visit: www.vincotech.com/fastPACK-0-1-MOS

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