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Hailo, Lanner Electronics partner on next-generation AI inference

Hailo, Lanner Electronics partner on next-generation AI inference

Business news |
By Jean-Pierre Joosting



Leading AI chipmaker Hailo as announced its partnership with Lanner Electronics, a leader in the design and manufacturing of intelligent edge computing appliances, to launch groundbreaking AI inference products for real-time computer vision at the edge. Hailo has combined its Hailo-8™ AI acceleration module with Lanner’s edge computing boxes to create high-performance, compact devices to support the demands of emerging AI applications at the edge.

Lanner’s LEC-7242 industrial wireless gateway, combined with the Hailo-8™ AI acceleration module, leads to systems that process multiple video streams in real-time on a single device.

Smart cities, retail, and industrial operations require hundreds of cameras generating video streams that need to be processed locally, quickly, and efficiently with minimal latency. Scaling AI inference to meet this challenge requires ultra-high performance and easy to deploy solutions, which this joint offering provides.

Lanner’s LEC-2290 edge box pairs an x86 CPU with the Hailo-8 AI module to produce a system capable of optimizing demanding edge workloads and accelerating time-to-market for AI deployments. Lanner’s low-footprint LEC-7242 industrial wireless gateway integrates the Hailo-8 into a fanless, efficient appliance for real-time applications powered by AI at the edge. Both systems process multiple video streams in real-time on a single device, while securely transmitting curated metadata and insights with robust onboard network connectivity.


Lanner’s modular approach to network appliances provides a clear path for engineers looking to optimize neural processing workloads. Integrated with Hailo’s AI module, Lanner’s fanless Edge AI computers enable mission-critical applications such as video analytics, traffic management, access control, and beyond.

Hailo’s specialized Hailo-8™ AI acceleration module delivers unprecedented performance to edge devices. Featuring up to 26 Tera Operations Per Second (TOPS), the module is built with an innovative architecture that enables edge devices to run sophisticated deep learning applications that could previously only run on the cloud. Its advanced structure translates into higher performance, lower power, and minimal latency, enabling enhanced privacy and better reliability for smart devices operating at the edge.

https://hailo.ai
www.lannerinc.com

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