Half-bridge power modules provides up to 300-W of power for motor applications
Available in an ultra-compact 8x9x0.9 mm PQFN package, the IRSM808-105MH and IRSM807-105MH half-bridge power modules offer up to a 60 percent smaller footprint than existing 3-phase motor control power ICs to provide a highly compact heatsink-free solution for applications including compressor drives for refrigeration, pumps for heating and water circulation, air-conditioning fans, dishwashers, and automation systems.
IR’s patent pending µIPM product family offers a scalable power solution with common pin-out and package size. Featuring the most rugged and efficient high-voltage FredFET MOSFET switches optimized for variable frequency drives and IR’s most advanced high-voltage driver ICs, the µIPM product family offers DC current ratings ranging from 2 A to 10 A and voltages of 250 V and 500V. The new approach pioneered by IR for this market segment utilizes PCB copper traces to dissipate heat from the module, providing cost savings through a smaller package design and eliminating the need for an external heat sink. By using standard packaging QFN technology, assembly is simplified by eliminating through-hole second pass assembly and improving thermal performance compared to traditional dual-in-line module solutions.
Availability and Pricing
Pricing begins at $1.44 each for both the IRSM808-105MH and IRSM807-105MH in 10,000-unit quantities. Production quantities are available immediately. The devices are RoHS compliant.
More information about the IRSM808-105MH and IRSM807-105MH power modules at
www.irf.com/product-info/datasheets/data/irsm808-105mh.pdf
www.irf.com/product-info/datasheets/data/irsm807-105mh.pdf
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