Hall sensor in inverter design slashes cost
Silicon Austria Labs (SAL) has developed a proof of concept for integrating a Hall current sensor into a power module to be used in automotive traction inverter and DC-DC converter applications. The module (above) was developed with Asahi Kasei Microdevices (AKM) and improves the energy efficiency while reducing the size and weight of high voltage inverters with next-generation silicon carbide (SiC) power devices.
Traction inverters are the core component that powers the motors of electric drive systems in xEVs, serving as the bridge between the battery and electric drivetrain. These play a critical role in converting direct current from the battery into alternating current. To ensure smooth and efficient control across varying driving conditions—low or high speed, cruising or accelerating—precise current sensing over a wide dynamic range is essential.
The power module design uses the EZ232L linear Hall IC for coreless current sensors developed by AKM to overcome the limitations of conventional magnetic core-based current sensing. This allows the use of standard printed circuit boards with direct copper bonding of the SIC MOSFETs rather than requiring more expensive ceramic substrates, reducing the cost.
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“The designed power module integrates the latest direct copper bonded power semiconductors along with gate driving circuits and current sensing capabilities. Using a standard PCB and off-the-shelf components, the module provides both flexibility and cost advantages for small-to-medium production volumes,” said Thomas Langbauer, Team Lead within the Power Electronics Division at SAL.
“With this joint technology validation, we have set a new standard for current sensing in power modules, and we are proud to combine AKM’s expertise with SAL’s research capabilities to achieve this innovative result. We expect that the power module integrating coreless current sensor technology will contribute to smaller and lighter xEVs traction inverters,” said Toshinori Takatsuka, General Manager of AKM’s current sensor business.
AKM will present the results of the inverter module with SAL at PCIM Europe 2025 next month in Nuremberg, Germany, where SAL is also showing a range of power technologies at the show for the first time.
“For the first time at PCIM, we are presenting the full breadth of our competencies — from packaging to system-level solutions — tailored to various industries including automotive, industrial, and energy supply sectors,” said Alfred Binder, Head of Research Division Power Electronics.
The Sinterconnect discrete packaging is a wirebond-less interconnect for a GaN power semiconductor in a 100V application, offering up to 55% reduction in parasitic inductances and 15% reduction in thermal resistance compared to wire bonds, while a SiC-based solid-state circuit breaker rated for 40A and 800V with an ultra-fast response time of 160ns acts as an eFuse.
A HERIC AC-DC converter employs the latest monolithic bidirectional GaN switches (M-BDS) reduces common-mode emissions and minimized EMI filter volume, while a novel control board using both an FPGA for computational power and a microcontroller implements ultra-fast control strategies and low latency communication interfaces for the retrofitting of wind turbines.
SAL has also developed an industrial demonstrator for its Tiny Power Box, a compact three-phase 11kW bidirectional onboard charger with an integrated low-voltage auxiliary supply, highlighting high power density and system integration.
www.akm.com/global/en/; www.silicon-austria-labs.com/en/
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