Hamamatsu Photonics to build opto-semiconductor factory

Hamamatsu Photonics to build opto-semiconductor factory

Business news |
By Jean-Pierre Joosting

Hamamatsu Photonics will construct a new factory at its Shingai Factory site located in Shingai-cho, Minami-ku, Hamamatsu City, Japan to increase overall production capacity in the post-processing (dicing, assembly, and inspection) of opto-semiconductor devices. Mainly used for semiconductor manufacturing, testing equipment and LiDAR-related devices, it will support the expanding sales demands. The new factory building is expected be completed in March, 2025.

Hamamatsu Photonics has been supplying opto-semiconductor products for a broad range of fields including medical, industrial and automotive applications. In recent years, demand for image sensors used in semiconductor manufacturing and testing equipment has continued to grow, and since photodiodes for the automotive LiDAR market is also expected to expand, we anticipate a constant sales increase in the future.

Construction of the new factory building will expand production space for image sensors and photodiodes to meet an ever-increasing product demand. This new building will connect to the two existing factory buildings to integrate the clean rooms at the Shingai Factory into one area space. This will allow us to streamline the movement of people and materials to improve production efficiency as well as automate the manufacturing process and save labor through digital transformation.

The third Shingai factory building is designed to be highly resistant to natural disasters by integrating earthquake and flood countermeasures into its structure in conformance with our business continuity planning. Its proactive design features include eco-friendly measures such as heat-insulating structures and solar power generation systems. Construction of this new factory building will complete our major capital investments at the Shingai Factory site.

Since demand for opto-semiconductors is widely expected to see future growth, we plan to construct another factory building at our main factory site for wafer pre-processing within the next three years. Here we expect to establish a new manufacturing process for 8-inch diameter silicon wafers with a larger area than conventional 6-inch diameter waters. We aim to double the sales of our opto-semiconductor business in 10 years by expanding the post-processing capacity and further upgrading the production system through various business approaches including this investment.

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