HBM to be 20% of DRAM market in 2024
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The AI-prompted demand for high-bandwidth memory (HBM) has driven manufacturers to almost triple the bit supply in 2024. This will take HBM revenue to 20 percent of the DRAM market, according to TrendForce.
The market research firm said industry is expected to allocate 270,000 wafers per month to HBM by the end of 2024 compared with 93,000 wafers per month at the end of 2023. As a result HBM’s revenue share within DRAM is set to jump from 8.4 percent in 2023 to 20.1 percent by the end of 2024.
Estimated HBM/TSV manufacturing capacity by supplier 2023, 2024. Source: TrendForce.
Analyst Avril Wu said that HBM die size is generally 35 to 45 percent larger than DDR5 memory of the same capacity. The yield rate (including through silicon via) is approximately 20 to 30 percent lower than DDR5 and the production cycle (including TSV) is 1.5 to 2 months longer than DDR5.
DRAM market 2022 to 2024 and HBM revenue share. Source: TrendForce.
With the production cycle for HBM being more than 6 months most orders are already locked in. TrendForce said (see SK Hynix has ‘sold out’ of HBM DRAMs for 2024).
Samsung’s total HBM capacity is expected to reach around 130,000 wafer starts per month (including TSV) by year-end; SK Hynix is around 120,000 wafer starts per month,
SK Hynix holds more than 90 percent of the HBM3 market, while Samsung is expected to gradually erode that dominance with the release of AMD’s MI300 over the next few quarters.
Related links and articles:
News articles:
SK Hynix has ‘sold out’ of HBM DRAMs for 2024
Samsung goes 12-high with HBM3E 36Gbyte DRAM
Micron begins production of a ‘better’ HBM3E memory
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