Heat sinks for high power devices

Heat sinks for high power devices

New Products |
By Nick Flaherty

The dualFLOW and quadFLOW active heat sinks are designed for use on moderate to high component density PCBs, including 1U and 2U boards. Alongside the active heat sinks with integral blowers, the family includes passive heat sinks that use available airflow to provide thermal management. 

The sinks feature an aluminium or copper straight fin base, with a powerful blower on top. dualFLOW heat sinks draw air from two opposite directions, and quadFLOW sinks pull air from all four linear sides. The fast moving, high volume air helps maximize thermal performance on crowded boards and tight enclosures with insufficient airflow for passive cooling.

The passive (fanless) cooling solutions in ATS’ ultra-cool family are straight-fin heat sinks. They come in blue anodized aluminium or nickel-plated copper depending on thermal performance and weight requirements. They are ideal for systems with open airflow from front to back. Aluminium fins reduce the overall weight, while copper fins spread heat more efficiently for better thermal performance.

All ATS heat sinks fit standard Intel LGA 2011 sockets (Socket R) square and LGA 2066 sockets (Socket R4) commonly used in high-end cloud and edge server applications. An optional backing plate is available for applications other than the Intel LGA 2011 socket.

Advanced Thermal Solutions –

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