
Heatsinks combine copper surfaces with aluminium bulk for maximum thermal conductivity
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By
eeNews Europe
For such applications, Fischer Elektronik developed a special process which makes it possible to combine contact surfaces made from copper (l = 380 W/m•k) level with an aluminium heatsink. The material thickness, number, geometry and the position of copper surfaces are all custom designed to meet the customer’s specifications. The manufacturer uses surface milling to control flatness and roughness for mounting semiconductor components.
Visit Fischer Elektronik at www.fischerelektronik.de
