High current phase control thyristors aim to replace older designs
The optimised design maximises the die to package ratio to give the 25% increase while retaining the same overall package mechanical footprint for DC drives.
The new device is the latest introduction in IXYS’ range of optimised thyristors. Increased performance is achieved by maximising the die size and an improved package design. The new silicon dice are bonded to a metal disc and encapsulated in fully hermetic industry standard ceramic packages. Overall, the new mechanical design presents reduced thermal resistance and the die has an enhanced electrical performance.
This new 56 mm die device has an average current rating of 2105 amperes at a heatsink temperature of 55°C and the larger die, plus the improved thermal design, gives a current surge rating of 28400 amperes. The industry standard 26 mm thick package has a 50 mm electrode contact diameter with an overall maximum diameter of 74 mm.
“This device will eventually replace the older designs, based on 53 mm silicon, offering higher current and improved performance in the same device footprint without increased cost. The new thyristors remain compatible with the old designs and can be used in the same electromechanical systems without modification,” said Frank Wakeman, IXYS UK’s Marketing and Technical Support Manager. “It is part of our overall strategy, of introducing devices that are lighter, smaller, with the ‘More Power less Package’ designs that offer weight and material savings to our customers.”
The new technology is available in two standard voltage grades. The N2055MC260 has a Vdrm/Vrrm of 2600V while the N2055MC280 has a Vdrm/Vrrm of 2800V. Typical applications include DC drives, soft starters and all controlled rectifier applications requiring devices in this power rating.
More information is at www.ixysuk.com
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