High-density, secure memory in small package
Its new 4GB high-density DDR3 memory module is designed to address avionics, mission computing, and sensor processing subsystems, which are tasked with analyzing multiple streams of data simultaneously, requiring increasing amounts of system memory. Offered in a compact ruggedized package, the new device, says the company, provides optimal data center-grade performance in harsh environments.
“Our new 4GB HD DDR3 module is an innovative offering for our customers’ volatile memory requirements, with the largest capacity available in the smallest form factor, making it ideal for use in modern commercial avionics, missile guidance subsystems, and radar applications,” says Chris Opoczynski, Vice President and General Manager of Mercury’s Microelectronics Secure Solutions group. “Our industry-leading HD memory modules are another proof point of our commitment to making trusted, secure, mission-critical solutions profoundly more accessible and affordable to aerospace and defense.”
Storing large volumes of memory in these applications often requires a circuit board consisting of several smaller memory blocks, which are difficult to fit into size-constrained applications. With its space-saving DDR3 device, says the company, multiple blocks of memory are consolidated into a single device smaller than a quarter, providing a 59% space savings compared to traditional 4GB DDR3 memory.
By using this smaller form factor device, says the company, system architects can take full advantage of the latest edge-processing modules, bringing AI-level functionality to the harshest environments. For more, see the company’s page on military-grade high-density DDR4, DDR3, DDR2, DDR memory.
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