High-heat-resistant flexible printed circuit
The YFLEX flexible printed circuit board from Yamaichi Electronics is now also available as a high-heat resistant version for extreme environments. This innovative FPC was developed to meet the requirements in areas such as automotive, semiconductor manufacturing and test and measurement technology.
The high-temperature resistant YFLEX flexible printed circuit features an improved insulating layer, which has increased adhesion thanks to the use of a special cover layer. Even under extreme temperatures of up to 150°C, it retains its electrical properties for over 3,000 hours. The continuity resistance remains within a rate of change of ±10% and the insulation resistance is 500 MΩ or higher. This outstanding resistance ensures the reliable performance of the FPC even in the most adverse environments.
The printed circuit board is extremely versatile and can be produced in both single-layer and double-layer configurations. The insulation substrate base can be selected from liquid crystal polymer (LCP) or polyimide (PI) in order to optimally adapt to different applications. In addition, it has a reinforced GND design that is suitable not only for high-heat-resistant but also for noise-resistant FPC applications.
Yamaichi Electronics is now accepting orders worldwide for the groundbreaking YFLEX high-temperature flexible printed circuit board.
YFLEX is a special high speed flexible printed circuit that is able to transmit up to 112 Gbps with differential Impedance of 100 Ohm. This high performance is given by different features, like LCP as base material, the contacting of different layers done by silver bumps and the special production process.
A variety of other options are available including:
- A single-sided, long and highly YFLEX flexible circuit consisting of copper layer, polyimide cover films and LCP as base material.
- Double-sided option that consists of two copper layers with top and bottom cover films.
- An EMI prevention flexible circuit that can be used in wiring areas with concerns about communications quality degradation due to noise in electronic devices.
- A Slit and Bundle vision that combines a flexible printed circuit with the bundling feature of twinax or coax cables. This special high-speed flexible circuit can transmit up to 56 Gbps-PAM4 with a differential impedance of 100 Ohm.
- Heater flexible printed circuits that generate heat by passing electricity through a conductor.
- An ultra-thin flexible printed circuit with a total thickness of 39.5 μm (single-sided wiring).
- An oil resistant flexible printed circuit that is ideal for environments where cutting oil and other chemicals are sprayed.
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