High-integration system design simplified with Zynq-on-a-module

High-integration system design simplified with Zynq-on-a-module

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By Graham Prophet

Trenz Electronic (Bünde, Germany), a designer of FPGA and SoC-based products, has launched its TE0808 UltraSoM+ high-performance, industrial grade system-on-module, packaging the Xilinx Zynq technology into a compact 52 x 76 mm form factor.


With processing resources comprising quad-core ARM Cortex A-53 and dual-core Cortex-R5, plus FPGA, Xilinx’s Zynq UltraScale+ MPSoC is the heart of the TE0808 UltraSoM+ system-on-module; also on-board is up to 4 GB of DDR4 SDRAM main memory with 32-bit width, up to 512 MB of Flash memory for configuration and operation, and assembly options to add additional volatile or non-volatile memory. Supported are Micron XTRMFlash and Spansion/Cypress HyperRAM or HyperFlash devices. Also integrated is an onboard switch-mode power delivery subsystem that includes 14 DC/DC converters and 13 LDO regulators controlled by an ultra-low power MCU to provide flexible power-saving modes. Rugged board-to-board stacking connectors provide a total of 480 terminals supporting high-speed transceiver I/Os to the processing system and programmable logic in the FPGA part. An ultra-low jitter PLL provides all required clocks to the 20 serial transceivers.

With the Zynq UltraScale+ MPSoC as its processing engine, the TE0808 UltraSoM+ system-on-module provides design engineers with an extremely versatile, all-programmable heterogeneous multiprocessing environment for the development of next-generation embedded systems. The system can offload critical applications like graphics and video pipelining to dedicated processing blocks (the Xilinx SoC also includes ARM Mali engine), as well as turn blocks on and off through efficient power domains and gated power islands. The forthcoming UltraITX+ companion baseboard enables the TE0808 UltraSoM+ to be installed in standard PC enclosures.


“The TE0808 UltraSoM+ is the first implementation of the Zynq UltraScale+ MPSoC in a system-on-module,” said Thorsten Trenz, CEO of Trenz Electronic. “It gives design engineers the technical edge they have been looking for as they grapple with the significant demands of developing the next generation of multi-tasking embedded systems.”


“The TE0808 UltraSoM+ is a truly innovative implementation of our Zynq UltraScale+ MPSoC,” said Mark Jensen, Director of Corporate Software Strategy & Marketing, Xilinx. “With Zynq UltraScale+ MPSoC technology at the heart of Trenz’s TE0808 UltraSoM+ system-on-module, designers will benefit from unparalleled flexibility, dramatically lower BOM costs, and overall project acceleration for complex embedded designs.”


Trenz Electronic;



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