High-power-density 1200V/75A IGBT in TO-247PLUS package
Compared to a regular TO-247-3 package, the TO-247PLUS package can provide double current rating. Due to the removal of the mounting hole from the standard TO-247 package, the PLUS package has a larger lead frame area and thus can accommodate bigger IGBT chips, so that 75A 1200V co-packed IGBTs with the same small footprint are available for the first time. The larger lead frame provides a lower thermal resistance of the TO-247PLUS package, leading to an improved heat dissipation capability.
For designers looking to improve the switching losses, the TO-247PLUS 4pin package features an extra Kelvin emitter source pin. This allows for an ultra-low inductance gate-emitter control loop and reduces the total switching losses E(ts) by more than 20%. These IGBTs can be used to increase the system power density and/or reduce the number of power devices used in parallel, increase system efficiency or improve system thermal conditions.
Typical applications with a blocking voltage of 1200V requiring high power density are drives, photovoltaic, and uninterruptible power supplies (UPS). Additional applications comprise battery charging and energy storage systems.
Infineon; www.infineon.com/to-247plus and www.infineon.com/to-247-4
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