High power density 650V IGBT in surface mount D2PAK package

High power density 650V IGBT in surface mount D2PAK package

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By Nick Flaherty

The IGBT uses the thin wafer TRENCHSTOP5 technology to meet the growing demand for higher power density in power devices for automated surface mounted assembly. Typical applications requiring high power density and efficiency are solar inverters, uninterruptible power supply (UPS), battery charging, and energy storage.

The family comprises 15 A, 20 A, 30 A single IGBT and 15 A, 20 A, 30 A and 40 A IGBT co-packed with the same current freewheeling diode.

The co-packaged device enables designers to upgrade existing designs, to develop new platforms with up to 25% higher power output or to reduce the quantity of power devices used in parallel and thus allowing more compact designs. This allows a D2PAK package to be considered as an alternative to D3PAK or TO-247 for surface mounting. This supports easy soldering, leading to fast and reliable assembly.

The TRENCHSTOP 5 650V IGBTs in D2PAK are available in high volume production.

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