High-power projectors provide a system output of up to 1700 lumen

High-power projectors provide a system output of up to 1700 lumen

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Osram Opto Semiconductors has launched two high-power versions of the Osram Ostar Projection for projectors with a brightness of up to 1700 lumen. Thanks to their optimized product design they offer high luminous flux from the available chip surface.
By eeNews Europe


Between 1000 and 8300 lumen can be produced depending on the color and the LED version. An antireflex coated glass cover instead of the usual lens, together with external optics, ensures that the light is very well bundled. The new LEDs are therefore ideally matched to the efficient lighting from various additional optics.

The two new light emitting diodes offer so much luminous flux that they can be used in office projectors with brightness levels of up to 1700 lumen. At the heart of the product is a 2 mm² LED high-current chip based on state-of-the-art thin-film and UX:3 technologies. The two LED versions contain two (P1W) or four chips (P2W) with a total luminous area of 4 mm² and 8 mm² respectively.

In LED projectors three LEDs in the colors red, green and blue serve as the light source. The LEDs are pulsed one after the other (color sequential mode), making the color filter wheel used in classic lamp projectors superfluous. The high output of the new LEDs comes from the latest chip technologies and Osram C² conversion technology for a particularly efficient green. The P2W version emits light pulses with brightnesses of 1000, 2500 and 8300 lumen for Blue, Red and Green. These high brightness levels require current pulses of up to 32 amps (8 amps per chip) and optimized product design to efficiently remove the resulting heat.

Osram Ostar Projection enables light to be routed as efficiently as possible through the optical system which is restricted by the etendue. The etendue of the light emitting diodes is retained and, in conjunction with external optics, produces an extremely narrow beam of light. Etendue describes the relationship between the emitting light surface and the projected light surface.

To keep the thermal resistance and therefore the temperature rise at the LEDs at a low level the chips are placed directly on a copper plate and not in a classic LED package. They are screwed down to improve the connection with the heat sink.

Volume production is due to start in March.

Visit Osram Opto Semiconductors at www.osram-os.com

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