High-reliability solder alloy increases drop-shock performance in portable electronics
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SACM is doped with manganese and contains less silver than other Pb-free alloys. The manganese provides increased strength, and the reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications.
The platform consists of Indium8.9 Series solder pastes using Indium Corporation’s patent-pending SACM solder alloy technology for board-side interconnect, and SACM solder balls (spheres) for package-level interconnect.
Indium8.9HF halogen-free, Pb-free solder paste is one of the standard flux vehicles for SACM, it provides excellent soldering performance under high temperature and long reflow processes.
Visit Indium Corporation at www.indium.com/SACM
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