High-speed cabling routes data centre traffic faster than PCBs
BiPass I/O and backplane cable assemblies combine QSFP+, Impel or near-ASIC (Application Specific Integrated Circuit) connectors with thin twinax cables. The BiPass I/O and Backplane Assemblies provide a low-insertion-loss alternative to PCB traces capable of meeting 112 Gbps PAM-4 (pulse-amplitude modulation) protocol.
Datacentre and other designers creating TOR switches, routers and servers need, Molex notes, high performance I/O and backplane connections. They must be capable of high bandwidth speeds and efficiency, while ensuring proper thermal management in densely packed circuits without sacrificing signal integrity. BiPass Assemblies provide terminated I/O ports that connect via twinax cables to high density, high performance near-ASIC connectors in order to maintain the highest level of signal integrity from ASICs to the I/O. BiPass Assemblies also use near-ASIC connectors with low stack height for a smaller footprint within trays and panels to overcome space constraints.
“BiPass Assemblies offer our customers a complete solution to enable 56 Gbps and 112 Gbps PAM-4 implementation by dramatically reducing signal to noise ratios from the ASIC to I/O,” Molex adds.
Molex; www.molex.com/link/bipass.html
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