High speed flip-chip packaging for ESD protection
Nexperia has developed a packaging technology it calls flip-chip land grid array (FC-LGA) for the industry’s first ESD diodes with side-wettable flank.
The bidirectional electrostatic discharge (ESD) protection diodes in FC-LGA packaging is used to protect and filter high sped data lines in vehicles. Applications like in-vehicle camera video-links, multi-gigabit automotive Ethernet networks as well as infotainment interfaces like USBx, HDMIx, and PCIex, can be protected against potentially damaging ESD events.
The advantage of the flip-chip packages is that they have minimal parasitic components and come without bond wires or copper lead frames that can compromise the signal integrity.
The 2- and 3-pin FC-LGA diodes have capacitance of under 0.25 pF and insertion loss of -3 dB at 14.6 GHz for high speed data.
Both the 2-pin DFN1006L(D)-2 and 3-pin DFN1006L(D)-3 share the same footprint as their standard counterparts, ensuring drop-in compatibility. They provide up to 6 GHz bandwidth improvement compared to conventional DFN technologies. The 3-pin version can protect two channels and offer capacitance matching saves more space while further improving circuit performance and stability.
The diodes also come with reverse working voltages (Vrwm) from 5V and 18V to 24V and 30V. Higher voltage devices provide the additional advantage of flexible board placement for protecting multiple devices connected at various points along a link.
Side-wettable flanks (SWF) allow the use of automated optical inspection (AOI) of solder joints to ensure that they meet the exacting quality requirements of the automotive industry, where safety is paramount.
“These new diodes combine side-wettable flanks with a DFN1006 footprint optimized for maximum signal integrity and represent a significant improvement to the options currently available. Designed to support the growing trend of data-intensive automotive applications, they reflect Nexperia’s proven expertise in packaging technology. This launch reinforces our commitment to delivering innovative solutions that meet the evolving demands of engineers across a wide range of industries,” says Alexander Benedix, Head of Product Group Protection and Filtering at Nexperia.
The first three 5 V Flip-Chip diodes are in mass production. Six products with 18 V, 24 V and 30 V are sampling and will be available in mass production in the next three months.
www.nexperia.com/flip-chip-esd-protection
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