High speed signal transmission photorelays in a 2.00×1.45×1.65mm footprint
The device is rated for 60V (VOFF) and a maximum current of 0.4A (ION). The device is housed in an S-VSON4 package measuring just 2.00×1.45×1.65mm. The TLP3440S is housed in a new S-VSON4T package, which has the same industry-leading small footprint (2.00×1.45mm) as the S-VSON4 but is thinner at just 1.30mm. The TLP3440S features a low RON of 12.0Ω (typ.) and is rated for 40V (VOFF) and a max current of 0.12A (ION). Its switching times are 0.2ms (ton) and 0.3ms (toff).
When off, both devices consume just 1nA (IOFF). The footprint of the new photorelays is 22.5% smaller than that of existing VSON4 packages. Used in combination, the new devices will help to reduce PCB sizes in all applications including semiconductor testers, probe cards and replacement of mechanical relays. They can be also be used in gigahertz high-speed signal transmission lines.
Unlike typical photorelays, which have a maximum operating temperature of 85°C, the TLP3440S and TLP3475S can operate between -40°C and 110°C, and therefore simplify system design – especially in industrial and other rugged applications.
Toshiba Electronics Europe – www.toshiba.semicon-storage.com
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