High-strength thermal adhesive speeds up clip/screw-less assembly
The two-part liquid adhesive can be stored without refrigeration, and achieves high bond strength after heat curing. Liqui-Bond SA 3505 has thermal conductivity of 3.5W/m-K, previously unavailable in a structural adhesive, and displays shear strength of 3.15MPa when cured. Its high bond strength allows use for many purposes including PCB attachment, providing a fast and easy-to-use alternative to conventional fixings. In addition, mild elastic properties help alleviate Coefficient of Thermal Expansion (CTE) stresses during thermal cycling. For applications where a consistent stand-off or dielectric integrity is critical, the adhesive can be ordered with 0.18mm or 0.25mm glass beads.
The adhesive’s thixotropic properties promote easy flowing during assembly with minimal stress on fragile components, and ensure the deposit will remain in place until cured. Its shear thinning characteristics support optimised dispensing, while availability in cartridge or kit form allows use with either manual or automated dispensing equipment.
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