High-temperature electronics operates at 300°C
According to the analysis of the Fraunhofer institutes, the market for high-temperature is in need of components and connecting technologies that reliably work at temperatures up to 300°C – at higher package density than available electronic components. This requirement however calls for entirely new approaches to system integration. In the HOT 300 project, the Fraunhofer institutes, these approaches and techniques have been devised. The group now presented the results of its activities.
Among others, the five Fraunhofer institutes introduced a CMOS chip technology as well as a MEMS-based multifunctional sensor that can serve as basis semiconductor components for 300°C electronics. The designs are utilising ceramics-based substrates and metallic lead frames. For the encapsulation, the scientists developed a novel polymer ceramics material. For the temperature-stable interconnect technique of chip, substrate and package, the group developed specific methods of diffusion soldering and sinter processes as well as directly connecting ceramics and silicon.
Operating temperatures up to 300°C also requires new reliability models. Fault analysis for micro and nano structures, mechanical parameter determination and thermal shock resistance have been further developed and adapted to the wider temperature range, resulting in enhanced reliability models. The technologies developed are now offered to interested commercial parties.
Involved were the Fraunhofer Institute for Microelectronic Circuits (IMS), Fraunhofer Institute for Electronic Nano Systems (ENAS), Fraunhofer Institute for Ceramic Technologies and Systems (IKTS), Fraunhofer Institute for Materials Mechanics (IWM) and Fraunhofer Institute for Reliability and Microintegration (IZM).
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