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High voltage photorelays fit in industry’s smallest package

High voltage photorelays fit in industry’s smallest package

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By eeNews Europe



The latest additions to the TLP34xx series offer low off-state capacitance, low on-state resistance and high voltage support.

The devices support trigger LED currents of 3 mA (max.) and isolation voltage of 300 Vrms(min.). By expanding the variation of voltage and ‘C × R’, the photorelays can support a variety of applications including semiconductor testers, measurement equipment, automatic test equipment as well as working as replacements to reed relays.

The products have the same electrical characteristics as Toshiba’s small­size package USOP4 series, but reduce required assembly area by approximately 50% by using the VSON4 package that measures 1.5 mm by 2.5 mm x 1.3 mm thick. This can contribute to smaller and thinner products, and also makes it possible to increase the number of photorelays on a circuit board without increasing its size.

The line­up includes TLP3442, which realizes the industry’s lowest off­state capacitance (COFF), 0.3 pF (typ.), and TLP3431, which is suited for use in high­frequency signal transmission with a low on­state resistance (RON) of 0.8 ohm (typ.). The TLP34xx series covers both the low COFF and low RON range in an ultra­small VSON4 package.

www.toshiba.semicon-storage.com

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