Higher integration in LIN transceiver chips

Higher integration in LIN transceiver chips

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By eeNews Europe

Local interconnect network (LIN) nodes are seeing rapid growth rates in cars, resulting in master modules controlling multiple LIN buses. To address this growing need for multi LIN transceiver systems Melexis has a new generation of 2 and 4-channel LIN transceiver ICs. The MLX80002/4 can reduce system costs of the LIN physical layer by 20% compared to multiple single transceiver ICs found in, for example, a body control module (BCM).

The MLX80002/4 combines two or respectively four LIN transceivers on one die and is functionally backward compatible to the current reference standard; MLX80001. It enables the development of simpler and more cost effective multi-LIN network master modules. Integrated 1 kOhm LIN master termination resistors and decoupling diodes further reduce system costs. The integrated power management function enables easy management of the different LIN channels. This 2/4-channel LIN transceiver is produced in 0.35 micron HV-CMOS technology and is based on the single channel transceiver MLX80020.

The LIN bus continues its successful adoption in automotive and industrial applications with the release of LIN version 2.x and the release of SAE J2602 networking specification. This robust, cost effective communication scheme enables many basic networking functions in sub-systems previously considered to be uneconomical for smart actuators and controls. There is a need for BCMs to manage different LIN bus sub-systems at the same time.

EMC behaviour of LIN bus ICs is critical in automotive applications. The MLX80002/4 design has a high degree of robustness when subjected to the injection of high frequency disturbances. The IC exhibits very low electromagnetic emission to further simplify the design challenges of networked communication in hostile automotive environments. For the data transmission according SAEJ2602 a special low slew mode is available.

The MLX80002/4 meets the automotive temperature range of -40°C to 125°C and has on-chip protection against over-temperature, 40V load dump and LIN short to ground. The integrated standby management assures that the MLX80002/4 can ‘wake up’ from the LIN bus itself or directly from a connected microcontroller or other external source. Further integrated security mechanism such as RxD timeout, TxD timeout and sleep timer increases the LIN bus availability in case of fault conditions. To support the demand for decreased standby current the typical current consumption in sleep mode is 10 µA. Qualified samples are available and come in a space saving 24-pin QFN 4×4 RoHS compliant package. The usage of the same package for both IC versions enables easy scalability of the LIN channels. The ICs are fully PPAP and qualified according AECQ-100.


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