Highly Integrated Optical Sensors project successfully completed | AMS
Sensors play a key role in many applications in markets including mobile and consumer, automotive, and industrial. One thing is constant across these fields: the challenging demand for high performance, such as high sensitivity or low power consumption, often in combination with small size and low cost. However, this drives the need for sensor integration with electronics and other system components which can be highly complex to achieve.
The HIOS Consortium addressed this need for collaborative innovation in the growing market for intelligent light sensors. In particular, HIOS developed and launched the world’s first light sensor with fully integrated optical stack including multiple filters and an aperture replacing multiple discrete components. The sensor in 3D technology, IC filter and Wafer Level Optics integration technology developed in the HIOS project is also expected to bring further cost-efficient, very small, and high-performance sensors to the market. ams established a high-volume production environment for 3D/Through Silicon Via (TSV) process technology which has now been extended by equipment and processes for on-chip inorganic optical filters and wafer level molding to form on-chip optical components.
HIOS’ goal was to develop an industry-leading class of new optical sensor products offering the highest possible integration of components and miniaturization. Departing from the initial concept for an Ambient Light Sensor, the project focused on enabling the later launch of a color sensor as an achievable target. To reach this shared goal, all partners had to push the boundaries of capabilities in their fields while cooperating seamlessly at the same time.
Bühler developed and enhanced new equipment for advanced optical interference filter processing and announced its new deposition tool for high performance optical coating, HELIOS Gen II, in February 2019. This is the latest version of its highly-successful sputter tool with improved layer distribution and enhanced low particle process. New hardware and PARMS+ process lead to a tighter specification with high productivity and yield. Boschman successfully established a new level of accuracy with its molding tool and process development for optical packaging applications being capable to form diffusor layers, lenses and apertures.
More information on ams European research projects can be found at https://ams.com/eu-projects
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