HyperRAM memory chip doubles bandwidth for low pin-count solutions
The memory chip features a new, enhanced 16-bit version of the HyperBus interface that doubles data transfer to 800 Mbps. With HyperRAM 3.0, Infineon offers a portfolio of memory solutions with high bandwidth, low pin count and low power requirements. The memory chip is suitable for applications that require RAM expansion memory, including Vehicle-to-Everything (V2X) in automotive, but also video buffering, factory automation and Artificial Intelligence of Things (AIoT), as well as applications that require scratch pad memory for intensive mathematical calculations.
The new HyperRAM 3.0 memory solutions achieve a much higher data transfer rate per pin than technologies currently on the market such as PSRAMs and SDR DRAMs. “Our low-power features enable higher energy efficiency without sacrificing data transfer,” said Ramesh Chettuvetty, senior director of applications and marketing in Infineon’s Automotive Division. “This also makes the memory ideal for industrial and IoT solutions.”
Infineon’s HyperRAM is a standalone PSRAM-based volatile memory that offers a simple and cost-optimised way to expand memory. Data rates are equivalent to SDR DRAM, but with significantly lower pin count and power requirements. The higher data throughput per pin of the HyperBus interface enables the use of microcontrollers (MCUs) with fewer pins and printed circuit boards with fewer layers. This opens up possibilities for less complex and thus cost-optimised designs.
In 2017, Infineon introduced the first generation of HyperRAM memories supporting the HyperBus interface. The second generation of HyperRAM memories was introduced in 2021 and supports both the Octal-xSPI and JEDEC-compliant HyperBus interfaces with data rates of up to 400 Mbps. The third generation, which has now been introduced, supports the new extended HyperBus interface, which enables data transfer rates of 800 MB/s. The HyperRAM memories have a memory density of 64 Mb to 512 Mb. They are AEC-Q100 qualified and support operating temperatures of up to 125°C.
HyperRAM 3.0 products are available now in a BGA-49 package.
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