The board can use cameras from embedded vision partners such as Basler. The 3.5 inch platform is modular and based on the SMARC standard allowing quick and cheap customization using off-the-shelf components. The congatec Embedded Vision Platform also offers long-term availability, ruggedness, low power consumption and high scalability.
The standardized SMARC Computer-on-Module connector allows the processor to be tailored to the application. 12 different processor module variants from the NXP i.MX 8 processor series are available from congatec, from the high-end i.MX 8 to the ultra-low-power i.MX 8M Mini. I/Os can also be adapted easily due to the modular concept. The board has been developed with Basler’s embedded vision specialists to be simple to use. With the camera drivers integrated into the BSP, the platform can be implemented without hardware-related programming.
The congatec embedded vision platform comes with the 13 megapixel Basler BCON for MIPI camera module. This camera module can be connected directly to the 3.5-inch board with no additional converter modules. The board supports MIPI-CSI 2.0, USB and GigE vision cameras, as well as the artificial intelligence and neural networks of the NXP i.MX8 ecosystem to allow image segmentation algorithms can be used. Fully compiled binaries for download are available through GitHub, including boot loader, Android, standard Linux, or Yocto, as well as the appropriate BSPs and processor-optimized Basler embedded vision software.