Board maker Variscite in Israel has developed a System on Module (SoM) using the NXP i.MX95 processor.
The DART-MX95 is aimed at high performance edge applications including industrial, medical, aviation, IoT, robotics, vision-capable and smart edge devices.
The NXP i.MX95 uses an energy flex architecture includes multiple heterogeneous processing domains with up to six cores, 2.0GHz ARM Cortex-A55, two independent real-time co-processors for safety/low-power, and real-time use, consisting of 250 MHz ARM Cortex-M7 and 800 MHz ARM Cortex-M33.
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The DART-MX95 SoM is part of Variscite’s DART Pin2Pin family which enables compatibility with modules based on the i.MX 8M/ 8M Plus/ 8M Mini. The Pin2Pin family provides an extended lifespan, reduced development time, costs, and risks as well as scalability to additional modules.
The platform includes a 2D/3D graphics accelerator powered by an ARM Mali core, advanced multimedia, integrated NPU accelerator and ISP, high safety and security capabilities that meet the ASIL-B and SIL2 compliances. High speed connectivity includes 2x GbE + 10GbE, 2x PCIe Gen 3.0, 2x USB 3.0/2.0, CAN FD, UART/USART, I2C/I3C, SPI/QSPI and ADC as well as dual-band 802.11ax/ac/a/b/g/n with optional 802.15.4 + BT/BLE5.3 wireless. It also supports up to 16 GB LPDDR5 and 128 GB of eMMC memory.
“As a Platinum partner with early access to NXP’s technology, Variscite has an enormous advantage in developing the next-gen System on Modules that give our customers the ability to create embedded devices of the future today,” said Ofer Austerlitz, VP Business Development and Sales of Variscite. “The DART-MX95 is a powerful addition to Variscite’s DART Pin2Pin family. It expands the scalability options this product family offers and future-proof customer’s applications.”
The i.MX95 was launched at CES in January and Variscite’s SoM and related evaluation kits will be launched simultaneously with NXP’s release of the i.MX95 silicon and its software.
Variscite ensures supply continuity of 15 years to preserve customers’ engineering investment in their embedded designs.