IBM leads calls for US semiconductor and packaging technology centres in New York

IBM leads calls for US semiconductor and packaging technology centres in New York

By Nick Flaherty

The US CHIPS Act legislation would create a National Semiconductor Technology Centre (NSTC) and the National Advanced Packaging Manufacturing Program in the US.

The letter is signed by CTOs and research directors at IBM, Analog Devices, Applied Materials, Danfoss, Global Foundries, KLA, Mythic, onsemi and Synopsys,  as well as Akoustics, Entegris, i3 Microsystems, Mosaic Microsystems, Nexgen Power Sytems and Seeqc.

Academics signing the letter came from Jackson State University, City University in New York, MIT, Purdue University, Rensselaer Polytechnic Institute, the State University of New York, University at Buffalo and the University of Illinois at Urbana-Champaign.

“The ongoing global semiconductor shortage is disrupting our supply chains, impacting consumers and businesses, and threatening our national security. This shortage exposes the lack of sustained domestic investment in the semiconductor industry and highlights the need for the United States to reinvest to guarantee a steady and secure supply of chips for long into the future,” says the letter.

“Together, we urge you to pass the U.S. Innovation and Competition Act (USICA), which, among other things, would fully fund the Creating Helpful Incentives to Produce Semiconductors for America Act (CHIPS Act).”

The NSTC is intended to serve as a hub to marshal semiconductor expertise and resources to provide breakthroughs in chip innovation and production, and it will support a steady supply of chips now and long into the future. However this needs ecosystem that is ‘prototype ready’ with first-class resources, scientists, facilities, and partners who can work quickly and efficiently to ease the global chip shortage and secure a strong domestic chip supply chain for the future, and the New York region is pushing to host it.

The letter points to IBM’s Albany Nanotech Complex is the product of billions of dollars in public and private investment over two decades and now hosts more than 2,700 industry experts, staff, students, and faculty who have produces the first chip using 2nm technology

“We have no time to waste. For the United States to retain its semiconductor leadership, we must act with speed and the NSTC should use existing assets to produce results quickly,” says the letter. “How we rise to the challenge of building resiliency back into our semiconductor supply chain is a defining moment not only for the nation, but also New York State, to retain our position as a leader in semiconductor innovation, research expertise and the workforce of the future. Additionally, New York is uniquely positioned to support new American semiconductor fabs, as we have more shovel-ready sites than any other state and have already established the infrastructure needed for new chip fabrication.

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