IC-package-board co-design tool tackles multi-die projects
The Package Integrator solution automates planning, assembly and optimization of today’s complex multi-die packages.
It incorporates a unique virtual die model concept for true IC-to-package co-optimization. In support of early marketing-level studies for a proposed new device, users can now plan, assemble and optimize complex systems with minimal source data.
This solution ensures that ICs, packages and PCBs are optimized with each other to reduce package substrate and PCB costs by efficient layer reduction, optimized interconnect paths, and streamlined/automated control of the design process.
The Xpedition Package Integrator product also provides the industry’s first formal flow for ball grid array (BGA) ball-map planning and optimization based on an “intelligent pin” concept, defined by user rules.
A multi-mode connectivity management system (incorporating hardware description language, spreadsheet and graphical schematic) provides cross-domain pin-mapping and system level cross-domain logical verification.
Additional features include cross-domain interconnect visualization in a single view, comprehensive and user-friendly multi-mode physical layout tools with industry leading routing for PCB, MCM, SiP, RF, Hybrid and BGA designs, and a fully automated library development.
The Xpedition Package Integrator flow leverages other Mentor Graphics tools such as the HyperLynx signal and power integrity product, FloTHERM computational fluid dynamics (CFD) thermal modelling tools, and the Valor NPI substrate fabrication checking tool.
To complete the Mentor Graphics co-design solution, Nimbic was acquired in 2014. The Nimbic technology provides Maxwell-accurate, 3D full-wave electromagnetic (EM) high-performance simulation solutions that accurately calculate complex electromagnetic fields for chip-package-board simulation.
Visit Mentor Graphics at www.mentor.com
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
