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IC solution reduces IO-Link development time and costs

IC solution reduces IO-Link development time and costs

By eeNews Europe



Arrow has been a member of the IO-Link Consortium since April.

The first new device is an STM32 MCU with the IO-Link Master software stack. Arrow worked together with TEConcept on the IOLM4P and the chip includes the proven TEConcept IO-Link Master stack and supports the connection of up to four independent IO-Link Devices at cycle times down to 400 µs. It is controlled via an SPI-based command interface by host systems through field busses or proprietary backplane busses.

More details and pre-registration:

www.arrow.com/iolinkchips

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