Iceotope, nVent team for precision immersive cooling

Iceotope, nVent team for precision immersive cooling

Business news |
By Nick Flaherty

nVent Electric is to use immersive colling technology from Iceotope Technologies in the UK for a range of modular integrated systems for data centre, edge and high-performance computing (HPC) applications.

nVent’s cooling systems, racks and enclosures from its brands such as Schroff and Raychem enable Iceotope’s immersion cooling technologies to be deployed in data centres and edge computing environments.

“Our customers’ needs for cooling capacity are constantly increasing because of the high-density, powerful infrastructure they support, such as data centres and other IT applications,” said Marc Caiola, nVent senior director, data centre and networking solutions. “Iceotope has developed a differentiating chassis-level precision immersion cooling platform and we look forward to collaborating with their innovative team as they expand their solutions portfolio.”

“All of us at Iceotope are excited about our relationship with nVent,” said David Craig, Iceotope chief executive officer. “Together we are innovating solutions that deliver truly game changing offerings that make all the real benefits of liquid cooling a reality in a scalable, secure and serviceable way.”

nVent’s air and liquid cooling solutions, combined with the portfolio of server racks, enclosures, intelligent power distribution units (PDUs), monitoring and sensors, electronic access control and infrastructure integration capabilities, enable rapid global deployment of immersion cooling technology in traditional rack footprints. This saves valuable data centre floor space and simplify deployments without sacrificing reliability, availability and serviceability.

One hundred percent sealed at chassis level, Iceotope’s liquid cooling systems isolate and protecting critical IT systems from the surrounding environment and atmosphere. Industry standard form factors allow for simple maintenance and hot swapping – in any location – or the need for heavy lifting gear. The chassis-level liquid cooling can easily accommodate the increasing heat loads from the latest processor roadmaps while helping reduce energy use.;

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