The products are 1.3Mpixel and 8Mpixel CMOS image sensors, both feature back-side illumination (BSI) and have 1.75-micron pixel and 1.4-micron pixel sizes, respectively. Both sensors are based on SMIC’s 0.13-micron BSI technology platform.
Based on a low leakage process, SMIC’s BSI process it only uses three aluminum metal layers for reduced cost and supports pixel sizes down to 1.4-micron for 8MP resolution CIS. SMIC also provides full in-house turn-key service which includes CIS wafer fabrication, color filter & micro-lens processing, TSV-CSP and testing to help customers shorten the supply chain with fast cycle time and low cost.
"Through working with our partner, Cista System Corp., we are very pleased with the achievement of the production phase for BSI technology," said Shiuh-Wuu Lee, executive vice president of technology development of SMIC, in a statement. "Tests on the two sensors have shown great performance which demonstrates our readiness in 0.13-micron BSI technology platform. SMIC is also developing 1.1-micron pixel BSI for 13-megapixel resolution and above, and 3D stacked BSI for high-end applications. With these new sets of products, we hope to provide high-quality CMOS image sensors to our customers at a competitive price."
Wilson Du, CEO of Cista, said: "As we move forward, we hope to see more of our designs used in wider applications such as consumer electronics, telecommunications, medical equipment, automotive industry, automation and other applications."
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