Imec advances 300mm quantum-dot SWIR integration
Imec has demonstrated a new way to build compact multispectral shortwave-infrared (SWIR) sensors by integrating colloidal quantum-dot photodiodes (QDPDs) directly onto metasurfaces fabricated on 300-mm CMOS wafers. The results, presented at IEDM 2025, point to a cost-effective and high-resolution SWIR imaging platform that could significantly expand commercial deployment.
The work is notable because it pushes SWIR sensing closer to mainstream CMOS manufacturing, opening opportunities for new products in security, automotive, industrial inspection and smart agriculture.
Why SWIR needs a different approach
SWIR imaging can reveal material differences and features that are invisible in the visible spectrum, enabling applications ranging from seeing through plastic and fabric to improving visibility in haze or smoke. Most existing SWIR detectors, however, remain pricey, bulky and difficult to scale. Quantum-dot sensors have emerged as a potential alternative thanks to lower manufacturing cost and high resolution, but until now they have largely operated as broadband devices rather than narrowband spectral imagers.
Imec’s new platform tackles this limitation by cointegrating QDPDs with CMOS-compatible metasurfaces—nanostructured layers that control light at sub-wavelength scale. Instead of redesigning the photodiode structure for each target wavelength, the metasurface handles spectral tuning while the same quantum-dot detector stack remains in place.
“What particularly sets this technology apart is its scalability,” says Vladimir Pejovic, R&D project lead at imec. “Traditional quantum dot image sensors require redesigning complex photodiode layers for every wavelength, which makes adjustments to each application’s spectrum complex and costly. Our approach shifts that complexity to the CMOS level, using metasurfaces to tune spectral response instead of altering the photodiode stack. This opens the door to easily customizable high-resolution spectral SWIR sensors and paves the way for new features in areas such as security, agriculture, automotive, aerospace, and beyond.”
Built on a 300-mm CMOS line
Because the process is demonstrated on imec’s 300-mm pilot line, it provides a viable route toward volume manufacturing. The approach also aligns with industry needs for compact, lightweight modules that can integrate easily into edge devices, drones, industrial cameras, or in-vehicle sensing systems.
The research combines three imec domains—quantum-dot imagers, flat-optics metasurfaces, and spectral imaging—into a single platform. The next milestone is transitioning from proof of concept to low-volume production with industry partners.
“Our ambition is to turn this breakthrough into an industry-ready platform,” says Pawel Malinowski, imec portfolio manager. “We want to work with partners to develop custom image sensors and integrated devices, demonstrating this technology in real-world applications. By combining imec’s spectral expertise, quantum dot know-how, and advanced CMOS process capabilities with specific application domains, we aim to accelerate innovation and bring next-generation SWIR sensors from proof-of-concept to full-scale manufacturing. Imec therefore welcomes collaboration with partners to help shape the future of sensing and imaging together.”
If adopted at scale, the technology could bring spectral SWIR sensing to markets previously blocked by size and cost constraints—an appealing prospect for Europe’s imaging, mobility and industrial-automation sectors.
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
