Imec and Huawei team up on high-bandwidth optical data link technology
Silicon photonics is a key enabling technology expected to revolutionise optical communications by paving the way for the creation of highly integrated, low power optical transceivers used for data transmission and telecommunications.
The research programme focuses on optimising bandwidth density, power consumption, thermal robustness and cost at the system level. Huawei engineers will work closely with imec’s R&D team in Leuven, Belgium, with a view to achieving technological progress in this vital area for delivering connectivity matching the needs of the Europe of tomorrow.
In 2013, Huawei acquired leading photonics company Caliopa spin-off from imec and UGent, thereby adding silicon photonics research to its European R&D portfolio. Delivering on its commitment of boosting Caliopa’s development, Huawei has been investing in its human resources and infrastructure, prompting it to move offices to keep step with its rapid growth.
“This is an important next step in our collaboration with Huawei on silicon photonics. This collaboration, together with Huawei’s recent acquisition of our spin-off Caliopa that focuses on developing silicon photonics-based optical transceivers for the telecommunications industry, shows that our silicon photonics research is important for advancing next-generation high-bandwidth ICT solutions,” stated Luc Van den hove, president and CEO at imec. “We expect this partnership to give a further boost to our silicon photonics research over the coming years.”
The collaboration further deepens Huawei’s engagement with the European research ecosystem in pursuit of its strategy to build a better-connected Europe by investing in local talent. The announcement follows the recent purchase of Internet of Things pioneering company Neul in the UK, the launch of an innovation centre in Walldorf, Germany, and the opening of an R&D site in Sophia Antipolis, France.
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