Immersion cooling for 100 server boards
The 48V technology, shown at the Open Compute Project (OCP) global summit in California this week, allows higher compute density of up to 100 two-socket servers and provides a solution that air cooling cannot meet.
In addition, Wiwynn evaluates liquid from different vendors, motherboards and servers including OCP TiogaPass server boards and Microsoft’s Project Olympus specification.
“Wiwynn is excited to introduce cutting-edge cooling solutions compatible with OCP servers,” said Dr. Sunlai Chang, Senior Vice President and CTO of Wiwynn. “It addresses the challenges of fast-growing power consumption and density for cloud computing, AI and HPC. We are committed to provide data centres with optimised TCO and ensure the system performance and reliability.”
One hundred OCP Tioga Pass server boards are immersed in a tank with 1.2m x 1.2m footprint. Two-phase immersion cooling technology is employed due to the high power density capacity and low Power Usage Efficiency (PUE) with warm water cooling. For servicing, two boards are face-to-face compacted in a cartridge with one-hand released handle which is installed in the tank vertically to connect 48 V power bus bar.
A sloped top cover design with 1.2 meter tank height design allows the front side service for the cartridge on rear side of the tank and a proprietary condenser system and water flow rate control are integrated in the tank management system to minimise vapour leakage during maintenance.
Other OCP power news:
- TOTAL IMMERSION POD FOR DATA CENTRE THERMAL MANAGEMENT
- 18 KW DC-DC POWER SHELF FOR OPEN COMPUTE PROJECT (OCP) APPLICATIONS
- 48V REFERENCE BOARD FOR FIRST INTEL 10NM SERVER CHIP
- POWER STAMP ALLIANCE LAUNCHES CONTROLLER SPECIFICATION
- 24KW AC-DC POWER SHELF FOR 48V SYSTEMS
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