Improved low-profile component cooling with the “Fansink”

Improved low-profile component cooling with the “Fansink”

New Products |
By eeNews Europe

Conventional heat sinks – ATS asserts – provide large amounts of cooling surface relative to their volumes. They work well in many applications where space is not an issue, including multi-U servers and workstations. But where space is highly constrained, cooling methods that rely on increased surface areas and airflow rate can’t adequately dissipate heat from high power electronic components. To cool components at this level, engineers have used liquid-based systems that perform well, but are costly, bulky, heavy, and present many points of potential failure while exposing electronics to liquid.

QuadFLOW fansinks are engineered for cooling high power electronic devices, such as CPUs and GPUs, using air alone. They are designed to maximise extraction of heat from their integral heat sink fins. ATS uses its own Multiple Flow Entrance Technology to engineer several fin fields on the same heat sink base area. These fin fields are not parallel to each other, but instead are designed to allow airflow to enter from multiple directions. These airflows reach a central core, where they are extracted by a blower through the multiple fin fields. Fins can be straight, curved or shaped with features depending on thermal performance requirements. The QuadFLOW internal wall design prevents any coupling of airflows between adjacent fin fields.

Cooling performance from QuadFLOW fansinks is near or equal to 0.1C/W depending on the configuration deployed. This level of thermal performance is attributed to the design of the fansink’s fin field and the plenum design that houses the blower while providing maximum airflow in each fin field chamber.

Advanced Thermal Solutions;

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