Indian chip maker to expand IC packaging capacity
Indian chip and manufacturing services company Continental Device India Pvt. Ltd. (New Delhi, India) is expanding its chip packaging business and could re-enter wafer fabrication, according to reports.
CDIL claims to be India’s oldest semiconductor company having started making semiconductors in 1964, although it exited wafer fabrication 15 years ago. The company is present in IC packaging and electronic manufacturing services.
The company plans to expand its capacity of 500 million units by 100 million units using the government’s production-linked incentive (PLI) scheme and the Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS) to set up two new ATMP lines over the next 18 months. The amount to be spent was not disclosed.
Prithvideep Singh, general manager, CDIL Semiconductors, told Mint that CDIL was considering building a wafer fab but that the decision would depend on a number of factors.
CDIL currently makes discrete semiconductor devices specialities in power semiconductors and high-reliability components using a fabless model but doing its own packaging. This allows it to meet stringent standards for applications in Space.
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