US automotive chip designer indie Semiconductor has opened its engineering centre of excellence (CoE) in Dresden, Germany.
The design centre is one of a series of European facilities that the company is either creating or expanding as part of its strategy to deliver local technical support for a rapidly growing base of OEM and Tier 1 automotive customers in the region.
Engineering teams at the 30-strong Dresden CoE are developing and supporting mixed-signal, semiconductor solutions deployed in products that address vehicle electrification and driver safety and automation applications.
This brings staff at indie’s EMEA design facilities in Scotland, Israel, Germany and Hungary to 100.
- Analog Devices sells German radar business to Indie Semi
- Indie Semiconductor in laser chip designer buy
The Dresden CoE provides functional safety design support, including the highest ASIL D level requirements and customized solutions. The technologies are enhancing driver and passenger user experience and accelerating mass-market deployment of highly integrated LiDAR, radar, computer vision, and ultrasound sensor solutions.
“Europe is the second largest vehicle market in the world and accounts for approximately 20% of global production and sales,” said Donald McClymont, co-founder and chief executive officer of indie. “By expanding our footprint in Germany, the Dresden CoE plays an important part in our strategy to provide high-quality, local resources in a country that is known for automotive excellence.”
Brendan McKearney, indie’s VP for sales and business development, EMEA, said “The local support from Dresden and our EMEA facilities, and direct access to our engineering teams enables an unmatched level of customer intimacy, helping customers meet their challenging schedules and project goals.”
Other Dresden articles
- €140m 3D chip research centre opens in Dresden
- Dresden attracts multi-billion € investments for chips, cars, IoT
- Bosch powers up chip production in Dresden
- Melexis announces Dresden R&D centre
Other articles on eeNews Europe
- Inova signs NXP, Microchip for automotive smart bus
- ASMI buys Italian SiC equipment maker for €425m
- €59m for UK fast charging tungsten battery cell startup
- Siemens sets up power lab in Wales
- First GDDR6 graphics DRAM with 24Gbit/s speed