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Industrial functional safety implementation package for Renesas RX111

Industrial functional safety implementation package for Renesas RX111

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By eeNews Europe



The RX111 Safety Package solution supports the power-efficient RX111 MCUs, which the company positions for sensor-based applications. Certified under the IEC 61508 SIL3 international functional safety standard, and meeting a strict third-party certification for MCUs, the RX111 Safety Package is a comprehensive MCU safety package. It includes an exhaustive self-diagnostic software library set that reaches diagnostic coverage representing more than 100,000 combinations to cover both random and systematic faults to support both SIL2 and SIL3 applications. The Safety Manual includes vital information such as FIT rates that can be passed on to a certifying body to reduce complexity in conformance. The solution significantly reduces the development time related to diagnostics performed on the MCU, by providing the safety analysis and study of failure diagnostic methods and diagnostic yields.

The RX111 Safety Package joins the RX631, RX63N Safety Package introduced in August 2014 for industrial equipment applications requiring high-speed data processing, such as motion monitoring or network communication.

Renesas; www.renesas.eu

next page; detailed features of the package…


Features of the RX111 Safety Package:

1) Diagnostic program for compact, power-efficient MCUs, suitable for use in sensor devices

The self-diagnostic software uses fault simulation to obtain a clear basis for diagnostic yields and contributes to more efficient development. To accommodate the comparatively smaller ROM capacity of the RX111 MCUs, Renesas has also reduced the self-diagnostic software to half the size of earlier versions for the RX631 and RX63N, further boosting the high cost-to-performance ratio associated with the RX111 devices. It is also possible to select a product version with smaller memory capacity to further boost performance relative to cost. This makes it easier to switch to electronic equivalents of mechanical safety mechanisms in applications such as state monitoring sensor devices, motor drive devices for torque cutoff control, safety relays, and safety switches.

2) IEC 61508 SIL3-certified for efficient safety development

The safety package includes a safety manual comprising a safety analysis of each of the MCU’s internal functional blocks. The software itself is performing self-diagnostics on the CPU, RAM and flash ROM. Fault simulation evaluation verifies the fault diagnostic rate of the CPU. This provides a precise basis for reporting the diagnostic rate. The complete safety package including the self-diagnostic software is IEC 61508 SIL3 certified by TÜV Rheinland Industrie Service GmbH of Germany, an internationally recognised third-party certification authority. Using this software eliminates the need to obtain separate qualification of the software development process conformance as required under the IEC 61508 standard. Engineers using the RX111 Safety Package can reduce the development period devoted to MCU safety analysis by approximately one-third.

3) The RX111 Safety Package Evaluation Kit for easy evaluation

The RX111 Safety Package Evaluation Kit bundles an evaluation board with a built-in RX111 MCU and self-diagnostic software, enabling system designers to get started immediately with diagnostic software performance evaluation and initial system consideration. The evaluation kit includes an evaluation version of the certified IAR Embedded Workbench for RX, Functional Safety Version (from IAR Systems) which has also been used for initial system assessment.

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