Kioxia has introduced a range of Industrial Grade 3D flash memory devices using its 3-bit-per-cell (triple-level cell, TLC) technology.
The BiCS FLASH 3D flash memory is available in a 132pin BGA package with densities from 512Gbits to 4Tbits to support the requirements of industrial applications from telecommunication and networking to embedded computing.
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The storage requirements for many industrial applications are much greater than solid state drives designed to be housed in climate-controlled data centres, including the need for extended temperature ranges and the ability to maintain high reliability and performance in rugged operating conditions.
The BiCS 3D flash has a wide temperature range (-40°C to +85°C) and one bit-per-cell (single-level cell, SLC) mode for applications that require faster read/write times and high cell endurance.
“The addition of next-generation Industrial Grade BiCS FLASH 3D flash memory continues our commitment to supporting the industrial market segment,” said Brian Kumagai, director of business development for Kioxia.
Sampling of the new KIOXIA Industrial Grade flash memory devices commenced earlier this year, with mass production expected late in the fourth quarter of 2022.