SolidRun in Israel has developed the world’s first rugged system design that combines 8-core AMD Ryzen 7040 series processors with multiple Hailo-8 AI accelerator chips.
The fanless Bedrock R7000 Edge AI PC is specifically designed for AI smart vision in harsh environments.
The system on module (SoM) design integrates with the AMD Ryzen 7840HS processor, a 4nm APU with 8C/16T Zen4 CPU and integrated RDNA 3 Radeon 780M GPU.
The 20 native PCIe Gen4 lanes and up to three Hailo-8 AI accelerators can be fully used with NVME Gen4x4 storage, dual 2.5 Gbit Ethernet and 4x4K displays. The CPU and all devices are passively cooled by an innovative fanless cooling system to give an industrial temperature range of -40ºC to 85ºC.
- Hailo ports transformer AI to embedded chip
- How transformers impact edge AI chip design
- Second generation AI vision processor targets smart vision
Demand for such high-performance Edge AI box-PCs is growing in all segments of the embedded market, including Industry 4.0, robotics, autonomous guided vehicles, healthcare, transportation, smart cities, retail, agriculture, defence and utilities.
The Bedrock R7000 is equipped with an AMD Ryzen 7 7840HS / 7840U processor, featuring 8 cores and 16 threads running at up to 5.1 GHz based on the AMD Zen4 4nm microarchitecture that also integrates the AMD Radeon 780M GPU with up to 12 CUs @ 2700 MHz. CPU power can be precisely adjusted in BIOS in an extremely wide range between 8W – 54W.
For Edge AI workloads, up to three Hailo-8 AI accelerators can be installed with combined inferencing performance of up to 78 TOPS.
The RAM and storage are modular with 2x SODIMMs supporting 64 GB DDR5 ECC/non-ECC, and 3 NVME 2280 PCIE Gen4x4 devices, including enterprise-grade NVME with power loss protection (PLP). RAM and storage are conduction-cooled for reliable operation at extreme temperatures.
I/O includes 4 displays comprising HDMI 2.1 + 3x DP 2.1, dual 2.5 Gbit Ethernet (Intel I226), optional WiFi 6E + BT 5.3, 5G or LTE modem, 4 USB 3.2 ports and a console port. All I/O is conveniently organized on a single face to simplify integration.
Bedrock R7000 supports all major PC operating systems, including most Linux distributions, Windows Desktop, Server and IoT.
- Layerscape edge DPU for cloud data
- World’s smallest 16 core ARM module
- Edge Gateway adds Wirepas wireless mesh support
The Bedrock R7000 design is modular, SoM based. Power input is by a dedicated interchangeable module for supporting various deployment use cases. The default PM 1260 supports a wide voltage range of 12V to 60V and 60W power.
The enclosure is made of heavy-duty machined aluminium with an anodized finish. It is offered in 3 variants. A 1.0 litre (45 mm (W) x 160 mm (H) x 130 mm) enclosure for dissipating up to 30W by convection, 1.6 litre (73 mm (W) x 160 mm (H) x 130 mm) for 60W and an 0.6 litre “Tile” variant for conduction cooling that measures 29 mm (W) x 160 mm (H) x 130 mm (D). The enclosure is suitable for DIN-Rail mounting with a specially designed zero-force locking bracket.
Cooling innovations include liquid metal TIM, 360º stacked heat pipes, dual-layer chimney effect heat exchanger and thermal coupling of all internal devices. The system operates reliably at a temperature range of -40ºC to 85ºC.
“Efficiency and scalability are key factors in advanced edge AI,” said Irad Stavi, IPC Product Line Manager at SolidRun. “Bedrock R7000 stands out as the first fanless IPC based on the ultra-efficient AMD Ryzen 7040 processor and the innovative modular design which enables out-of-the-box integration of 3 Hailo-8 AI accelerators, each with 26 Tera Operations per Second (TOPS), or even more with a simple customization.”
“An important feature of Hailo-8 AI accelerator and Hailo AI Software Suite is linear scaling of the inference performance simply by adding modules,” said Dima Caplan, Product Manager at Hailo. “SolidRun’s new Edge AI platform exhibits ample system resources which enable high AI performance at perfect scaling.”