Advantech is launching a series of industrial server cards based on the new COM-HPC standard.
All five COM-HPC module standards (A ~ E) will use 800 pins via two new high-speed connectors with at least 4 x 100 pins each and 2 x 400-pin board -to-board connectors. The standard supports higher bandwidths via innovative BGA-type board-to-board connectors, allowing PCIe 4.0 and PCIe Gen 5 (32GT/s) to be scaled to up to 65 lanes. The boards will have four USB 4.0 ports or USB 3.2 Gen. 2 x 2, up to 10GBASE-T and 8x ports 25GBASE-KR with sideband signals. COM-HPC also offers more low power I/O such as 12x GPIO, SPI, IPMB, I2C, and SMBus for intelligent system management.
The available board sizes also enable the adoption of high-level processors as the larger modules are compatible with 4 ~ 8 pcs long DIMM memory expansion sockets. The Size E specification features up to 1TB memory via 8x pcs long DIMM memory capacity. Size C offers 128GB via 4x pcs SODIMM
Additionally, the module’s TDP supports 110W processors, compared to 65W for COM-Express, and power inputs higher than 300W.
The new standard is aimed at supporting higher data rates than COM Express Type 7 for real time data synchronization and the processing of machinery in factory lines for industrial automation. It is also expected to be used in defence systems, medical imaging applications and warehouses employing robots
Advantech is a member of the PICMG COM-HPC subcommittee which plans to ratify the standard after two years of development.
“PICMG Is excited about the pending completion of the COM-HPC specification. Advantech continues to be a leader in IoT intelligent systems and embedded platforms. Their commitment to the development of COM-HPC will lead to the rapid adoption of the forthcoming open specification.” said by Jessica Isquith, PICMG President.
Advantech plans to release a COM-HPC evaluation kit called SOM-8990 and a carrier board called SOM-DB8900 in the fourth quarter of 2020 with a server pinout equipped with a 16 core, 110W Intel Xeon D processor. This Size E board will measure 200 x 160 mm (0.65 x 0.52 in) and will have up to 512GB memory with 8pcs 288pin RDIMM/LRDIMM with up to 45 lanes PCIe Gen. 3 (x16, x8, x4, x1), four ports of USB 3.0 and two of SATA III and up to four ports of 10GBASE-KR and one 1000BASE-T.
Related COM-HPC articles
- FIRST BOARD WITH TIGER LAKE PROCESSORS FOR NEW STANDARD
- 10nm PROCESSORS POWER FIVE EDGE FORMATS
- CONGATEC IN €115M PRIVATE EQUITY DEAL
Other articles on eeNews Europe
- Top articles in October on eeNews Europe
- CEA-Leti to build silicon photonic quantum computing communication platform for security
- Smart choices in Cree LED deal
- Tools enable 3nm designs on Samsung process