Infineon begins power chip wafer fab expansion in Kulim, Malaysia
German power semiconductor company Infineon Technologies AG has laid the foundation stone for a third wafer module at its site in Kulim, Malaysia.
Construction is expected to be completed by 3Q24 and to bring 900 additional jobs to the Infineon payroll in Kulim. Infineon is investing more than €2 billion to build the module that will generate €2 billion in additional annual revenue with products based on silicon carbide and gallium nitride.
Ms Lim Bee Vian, deputy CEO of the Malaysian Investment Development Authority (MIDA), said “I am pleased to note that Infineon Kulim’s third module will be instrumental in increasing Malaysia’s position in the global semiconductor supply chain. Our collective aim is to establish Malaysia as one of the key partners in global semiconductor supply chains.
Rutger Wijburg, COO of Infineon Technologies, said: “As decarbonisation efforts gain momentum globally, demand from electric vehicles, charging and storage infrastructures, and renewable energy for wide band gap power semiconductors is growing and we are prepared to support the demand.”
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