Infineon expands XENSIV MEMS microphone range
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Infineon has expanded its XENSIV MEMS microphone portfolio with two digital PDM devices aimed at raising signal quality while cutting power: the IM72D128V and the IM69D129F. The new XENSIV MEMS microphone duo targets consumer, IoT and automotive audio, where robustness and long battery life are critical.
For eeNews Europe readers, the combination of high SNR, IP57 protection via Sealed Dual Membrane (SDM) and sub-0.5 mA operating currents speaks directly to next-gen earbuds, ANC headsets, laptops/tablets and multi-mic arrays in embedded designs. It also suits voice UI front-ends and in-cabin infotainment, where consistent performance and tight tolerances simplify array calibration.
What’s new in the XENSIV parts
The IM72D128V focuses on premium capture: it delivers a 71.5 dB(A) SNR for low-noise pickup, while drawing just 430 µA in high-performance mode and 160 µA in low-power mode. Its 4 × 3 × 1.2 mm³ footprint balances array spacing with board real estate for wearables and portable audio. The compact IM69D129F offers a 69 dB(A) SNR at 450 µA/170 µA (high/low modes) in a smaller 3.5 × 2.65 × 0.98 mm³ package, making it a fit for dense multi-microphone designs. Both are digital PDM microphones with an integrated low-noise preamp and sigma-delta ADC for straightforward interface to common audio SoCs.
Infineon’s SDM construction delivers IP57 resistance to water and dust, extending use into harsher environments, from outdoor cameras and home monitoring to industrial sensing. Both parts cite an 11 Hz flat frequency response and ±1 dB sensitivity tolerance to ease beamforming across arrays, and comply with IEC 60747/60749 and JEDEC 47/20/22 reliability standards.
Why it matters
For embedded designers, the XENSIV MEMSmicrophone update offers a practical route to higher SNR at lower current, reducing BOM risk by keeping PDM signaling and tight sensitivity binning while adding environmental robustness. That combination is timely for multi-mic arrays moving into smaller consumer and automotive form factors.
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