Infineon Technologies has developed a security processor for payment smartcard to TSMC’s 28nm process technology, the first such chip to do so.
The 28nm process node is mature but has not so far been used for high volume security and smartcard applications.
Infineon says its SLC26P is the first security IC targeting high volume payment applications on 28nm.
- Chip shortage hits payment cards
- Infineon, Fingerprints team for biometric payment cards
- NXP, IBM look to post quantum algorithms for smart cards
Capacity issues at mature technologies of 90nm, 65nm and 40nm where there is also increased demand for automotive chips has created shortages in smartcard chips.
The move to 28nm increases the flexibility of sourcing the chips in volume and also provides lower power consumption. The SLC26P, based around ARM’s v8 Cortex-M microcontroller core will be the first in a portfolio of 28nm devices for smart card and embedded security IC applications in the coming years, including payment and transportation markets as well as identity and authentication solutions.
An EMVCo certification is expected to be available within December 2022 ready for smartcard production in 2023.
“Infineon is the first to make use of the 28 nm technology node for smart card ICs. This step emphasizes our long-term commitment to the security IC market,” said Ioannis Kabitoglou, Head of Digital Security & Identity Business Line of Infineon.
“The SLC26P is the first smart card IC product that will be manufactured in 28 nm technology. We are planning for a fast ramp of production in the first half of 2023. This will help us deliver to the continued high demand for cutting-edge security solutions and relieve the negative impact of the semiconductor shortages in security ICs.”
SLC26P is planned to ramp-up in production the first half of 2023 targeting to enable EMV payment smartcards with the new technology beginning in Q2 2023. Samples based on SLC26P are available now.