Infineon, Schweizer intensify cooperation in chip embedding

Infineon, Schweizer intensify cooperation in chip embedding

Partners |
By Christoph Hammerschmidt

Infineon Technologies and PCB manufacturer Schweizer Electronic AG are jointly developing an innovative approach to increase the efficiency of silicon carbide (SiC) chips. To this end, the partners are developing a solution to embed 1200 V CoolSiC chips from Infineon directly into printed circuit boards (PCB).

By embedding SiC components in PCBs, Infineon hopes to achieve higher efficiency. This would increase the range of electric cars while reducing overall system costs.

Both companies have already demonstrated the potential of the new approach: They were able to embed a 48 V MOSFET in a printed circuit board (PCB). This resulted in a 35 percent increase in performance. Schweizer contributes to this success with its p² Pack solution, which enables the embedding of power semiconductors in PCBs.

“Together we are pursuing the goal of improving automotive power electronics,” says Robert Hermann, Product Line Head Automotive High-Voltage Discretes and Chips, from Infineon. “The low inductance environment of a PCB enables clean and fast switching. Combined with the excellent performance of the 1200 V CoolSiC products, chip embedding enables highly integrated and efficient inverters that reduce overall system costs.”

Infineon and Schweizer will showcase the 1200 V CoolSiC chip embedding technology at PCIM Europe 2023, May 9-11 in Nuremberg, Germany.

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