Infineon ships HyperRAM 3.0 memory with double bandwidth
Infineon Technologies has launched a HyperRAM 3.0 low pin count memory chip that doubles the data throughput. The chip, developed with Winbond, was first announced in April but can now be ordered from Infineon.
The stand-alone PSRAM-based volatile memory features a new 16-bit extended version of the HyperBus interface that doubles throughput to 800 Mbit/s over the 8bit interface in version 2.0. The data rates are equivalent to SDR DRAM but with much lower pin-count in a 49 pin BGA and lower power requirements, allowing the use of microcontrollers (MCUs) with fewer pins and PCBs with fewer layers. This provides opportunities for lower-complexity and thus cost-optimized designs to support target applications.
As a result the chip is aimed at applications requiring expansion RAM memory, including video buffering, factory automation, Artificial Intelligence of Things (AIoT) and automotive vehicle-to-everything (V2X), as well as applications requiring scratch-pad memory for intense mathematical calculations.
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“With nearly three decades of memory solutions knowledge, we are excited to bring another industry-first to the market. The HyperRAM 3.0 memory solutions achieve a far higher throughput-per-pin than existing technologies in the market such as PSRAMs and SDR DRAMs,” said Ramesh Chettuvetty, Senior Director of Applications and Marketing at Infineon’s Automotive Division. “Our low-power features enable better power consumption, without sacrificing throughput, which also makes this memory ideal for industrial and IoT solutions.”
Infineon introduced the first generation of HyperRAM devices supporting the HyperBus interface in 2017. The second generation devices were introduced in 2021 and support both the Octal xSPI and HyperBus JEDEC-compliant interfaces with data rates of up to 400 Mbit/s.
HyperRAM devices are available in density range of 64 Mbit to 512 Mbit and are AEC-Q100 qualified and support industrial and automotive temperature grades up to 125°C.
HyperRAM 3.0 products can be ordered now in a BGA-49 package.
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