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Infineon, Stellantis team on power lab, devices

Infineon, Stellantis team on power lab, devices

Business news |
By Nick Flaherty

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Car maker Stellantis has signed a supply and capacity reservation agreement with Infineon Technologies for silicon power switches and silicon carbide (SiC) semiconductors as well as the Aurix microcontroller.

Stellantis and Infineon are also extending their cooperation with the implementation of a Joint Power Lab to define the next-generation scalable and intelligent power architecture enabling Stellantis’ software-defined vehicle.

The two will work jointly on the power architecture for Stellantis’ electric vehicles with FroFET switches and CoolSiC power MOSFETs.

nfineon’s PROFET smart power switches will replace traditional fuses, reduce wiring and enable Stellantis to become one of the first automakers to implement intelligent power network management.

The CoolSiC devices will be part of the Stellantis efforts to standardise its power modules, improve the performance and efficiency of EVs while also reducing costs across its brands.

The TriCore-based Aurix microcontrollers will be used for the first generation of the STLA Brain zonal architecture.

This is part of the Stellantis move to secure its chip supply chain.

“We are securing the supply of crucial semiconductor solutions required to continue our transition to an electrified future leveraging innovative E/E architectures for our next-generation platforms,” said Maxime Picat, Stellantis Chief Purchasing and Supplier Quality Officer.

“Infineon is now entering a collaboration and innovation partnership with Stellantis,” said Peter Schiefer, President of Infineon’s Automotive Division. “As the world’s leading automotive semiconductor vendor, we bring our product-to-system expertise and dependable electronics to the table. Our semiconductors drive the decarbonization and digitalization of mobility. They increase the efficiency of cars and enable software-defined architectures that will significantly improve the user experience.” 

The capacity deal covers the Infineon SiC fab in Kulim, Malaysia, the upcoming 300mm Smart Power Fab in Dresden, Germany, and the joint venture with TSMC and partners (ESMC) as well as accompanying supply agreements with foundry partners.

www.infineon.com

 

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