Infineon’s CoolMOS P7, now in SOT-223 for cost-effective package option
The configuration is designed to address needs of the low power SMPS market, with performance and ease-of-use, allowing improved form factors. It uses a price competitive Superjunction technology, which results in a reduced overall Bill of Materials (BOM) on the customer side.
The thermal behaviour of the CoolMOS P7 in this package was assessed across several applications. When the SOT-223 was placed on a DPAK footprint, the temperature increased by a maximum of 2-3°C compared to a standard DPAK. On copper area of 20 mm² or more, the thermal performance was equal to DPAK.
CoolMOS P7 in SOT-223 is available in 600V, 700V, and 800V devices. Additional on-resistance-rated versions of the 700V and 800V devices will be launched soon.
Infineon; www.infineon.com/p7 and www.infineon.com/sot-223
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